The 2026 Computing Network Development Conference & 4th AI Computing Industry Expo was grandly held at the China National Convention Center in Beijing on September 15–16. As a national "Specialized, Refined, Differential and Innovative" enterprise specializing in server hardware and liquid-cooled computing infrastructure, Toploong showcased a full lineup of self-developed liquid-cooled computing hardware platforms at the exhibition. The displays covered a comprehensive portfolio of product solutions for AI large-model training, high-density intelligent computing clusters, and edge computing scenarios. Leveraging mature liquid cooling technology and highly reliable server structural design, Toploong attracted numerous industry visitors, system integrators and computing operators for on-site visits and in-depth consultations.

At this exhibition, Toploong highlighted the HANHE 8162 8A tower-type low-pressure fully liquid-cooled server (liquid cooling for 8 GPUs), HANCHUAN TY42-4GPU (liquid cooling for 4 GPUs), high-density GPU liquid-cooled rack servers, as well as 1U and 2U OCSP server platforms. The product lineup fully addresses diverse computing requirements ranging from lightweight single-node computing to large-scale cluster computing.

Among the exhibits, the HANHE 8162 tower-type low-pressure fully liquid-cooled server was a major crowd favorite. Equipped with Toploong’s self-developed integrated CDU architecture, this unit features internal water distributors and multiple built-in sensors, alongside a touchscreen for real-time parameter display. It supports out-of-box deployment without data center retrofitting and accommodates 8 high-performance GPUs. The low-pressure full liquid cooling design effectively reduces noise and liquid leakage risks. Operating temperature stays below 60°C under full load, with noise kept under 60 decibels. It is well suited for AI laboratories and small-to-medium inference and training scenarios, solving the thermal challenge of high-power single-node computing.

The HANCHUAN TY42-4GPU liquid-cooled server and high-density GPU liquid-cooled rack servers are engineered for high-density clusters in data centers. Adopting rack-mounted cold-plate liquid cooling architecture, they deliver far superior heat dissipation compared with conventional air cooling. The servers sustain long-duration continuous AI computing workloads stably and help lower overall PUE, making them ideal for large-scale deployment in intelligent computing centers.

Also on display, the OCSP server platforms are built on next-generation processor architectures, delivering robust computing power and flexible scalability. They can meet customized hardware requirements for diversified computing services and serve as a solid hardware foundation for computing network infrastructure development.

Toploong’s booth maintained steady foot traffic throughout the event. Many computing service providers, system integrators and representatives from research institutes visited the stand to examine physical liquid-cooled servers. They engaged in detailed technical discussions with Toploong’s engineering team regarding liquid cooling pipeline design, cold plate manufacturing processes, system reliability, ODM customization for projects, and mass delivery lead times. A number of clients recognized Toploong’s integrated liquid-cooled complete machine solutions and explored potential cooperation on intelligent computing clusters and computing network node projects. Matching solutions to clients’ business scenarios, the team explained the applicable scope and operation & maintenance considerations of each model, and shared practical case studies of liquid cooling computing projects. This fully demonstrated Toploong’s technical expertise and mass-production capabilities in server hardware construction and liquid cooling thermal management.

Driven by the explosive growth of AI computing demand, heat dissipation and energy consumption bottlenecks brought by high-density computing have become core challenges in computing infrastructure construction. Liquid cooling technology is widely acknowledged across the industry as a key solution. With over two decades of experience in server hardware, Toploong keeps investing in R&D of liquid cooling thermal management and high-performance server structures. The company has established a complete product matrix covering tower single-node servers, rack multi-GPU liquid-cooled systems and supporting CDU cooling units. It provides one-stop services including chassis structure design, liquid cooling components and complete machine ODM.

Looking ahead to the development of the computing industry, Toploong will continue to focus on liquid-cooled computing infrastructure. The company will iterate liquid cooling structures, optimize thermal management schemes, and continuously improve the stability, cost-effectiveness and customizability of high-density computing hardware. Partnering with upstream and downstream industry stakeholders, Toploong will facilitate the construction of computing networks and continuously contribute hardware strength to the high-quality development of China’s AI computing industry.