"Singapore, September 2026" — TOPLOONG, a China-based manufacturer specializing in server chassis, industrial computer chassis, and advanced cooling infrastructure, is pleased to announce its participation in *Data Centre World Singapore 2026*.
As data centers continue to evolve toward higher computing density, AI acceleration, and more demanding thermal requirements, TOPLOONG will showcase a range of server infrastructure solutions designed for modern data center, AI computing, GPU server, storage, and industrial applications.
"Visit TOPLOONG at Booth Y21" to explore our latest server chassis, GPU server platforms, liquid cooling solutions, and customized hardware capabilities.

Meeting the Evolving Demands of Modern Data Centers
The rapid growth of AI, high-performance computing (HPC), cloud computing, and data-intensive applications is driving demand for higher-density and more efficient server infrastructure.
Traditional air cooling remains widely used, but high-power GPUs and increasingly dense computing platforms are creating new challenges in thermal management, power consumption, system reliability, and rack-level deployment.
TOPLOONG has developed a broad range of hardware solutions covering both traditional air-cooled platforms and liquid-cooled systems, providing customers with flexible options for different computing environments.
Our product and solution portfolio includes:
- Server chassis and rackmount chassis
- GPU server chassis and high-density computing platforms
- Storage server and NAS chassis
- Industrial computer (IPC) chassis
- Air-cooled server platforms
- Cold-plate liquid cooling solutions
- Internal-loop and external-loop liquid cooling architectures
- Liquid cooling manifolds and quick-connect systems
- Cooling monitoring and control solutions
- Customized and non-standard chassis design and manufacturing

Exploring Liquid Cooling for AI and High-Density Computing
One of the key highlights at the exhibition will be TOPLOONG's liquid cooling solutions for high-performance computing and GPU-intensive applications.
As GPU power density continues to increase, efficient heat removal is becoming an increasingly important part of server infrastructure design. Liquid cooling can provide a more direct approach to thermal management by transferring heat from high-power components through cold plates and liquid circulation systems.
TOPLOONG's liquid cooling architecture can integrate key components such as:
Cold plates + liquid manifolds + quick connectors + pumps + sensors + monitoring systems
Depeding on the application, different cooling architectures can be developed for GPU servers, AI computing platforms, HPC systems, and other high-density computing environments.
Our solutions are designed with a focus on thermal performance, system integration, maintainability, and customized deployment requirements.
8-GPU Liquid-Cooled Computing Platform
Among the solutions presented by TOPLOONG is its **8-GPU liquid-cooled computing platform**, developed for AI, scientific research, engineering simulation, professional visualization, and other compute-intensive workloads.
The platform integrates liquid cooling components into the server architecture to help manage the thermal load generated by high-performance GPUs and CPUs.
The system can incorporate:
- Up to 8 high-performance GPUs
- Liquid cooling cold plates
- Coolant distribution manifold
- Precision quick-connect fittings
- Multi-point temperature and system monitoring
- Pump and fan monitoring
- GPU/CPU thermal monitoring
- Power and performance monitoring
- Touchscreen monitoring interface
The platform is intended to provide a more integrated approach to high-density computing where conventional air cooling may become increasingly challenging.

From Standard Chassis to Customized Solutions
In addition to standard server chassis, TOPLOONG provides customized chassis development and manufacturing services.
Our engineering team can work with customers to develop solutions according to requirements such as:
- Motherboard dimensions and mounting positions
- GPU quantity and form factor
- PCIe expansion requirements
- Storage drive configuration
- PSU and redundant power requirements
- Fan and cooling layout
- Liquid cooling components
- Rack height and chassis depth
- Front and rear I/O requirements
- Mechanical structure and appearance
- Customized branding and structural design
This capability allows TOPLOONG to support customers not only with standard chassis products, but also with "OEM/ODM and project-based hardware development".
Supporting Data Center and AI Infrastructure Projects
TOPLOONG's solutions are applicable across a wide range of computing environments, including:
Data Centers | AI Computing | HPC | Cloud Computing | GPU Servers | Storage | Networking | Industrial Computing | Scientific Research
With more than two decades of experience in server and industrial computer chassis manufacturing, TOPLOONG combines mechanical engineering, thermal management, product development, and manufacturing capabilities to support customers from concept and prototype development through to production.
For customers developing new server platforms or looking for alternative chassis and cooling solutions, the TOPLOONG team will be available at the exhibition to discuss project requirements, technical specifications, customization options, and potential cooperation.

Meet TOPLOONG at Booth Y21
We warmly welcome data center operators, system integrators, server manufacturers, distributors, solution providers, engineers, procurement professionals, and technology partners to visit us during the exhibition.
Whether you are looking for a "standard server chassis, GPU server platform, storage chassis, industrial computer chassis, or customized liquid cooling solution", our team would be pleased to discuss your application and requirements.
Exhibition: Data Centre World Singapore 2026
Location: Singapore
Booth:Y21
Company: TOPLOONG / Shenzhen Toploong Technology Co., Ltd.
Visit us at Booth Y21 and discover how TOPLOONG can support the next generation of data center and high-performance computing infrastructure.
We look forward to meeting you in Singapore!
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